What is the recommended way to avoid defects during soldering?

To effectively avoid defects during soldering, it is essential to prioritize the avoidance of cross-contamination. Cross-contamination can occur when different types of materials, contaminants, or residues (such as oils, dirt, or previous solder residues) come into contact with the surfaces being soldered. This can severely compromise the quality of the solder joint, leading to weak connections and the potential for failure.

Maintaining a clean working environment and ensuring that the surfaces to be soldered are properly prepared—such as being free from oxidization and other foreign materials—greatly enhances the reliability and strength of the resultant solder joint. This practice is fundamental in achieving good wetting and adhesion of the solder to the base materials.

In contrast, employing the highest temperature possible can actually lead to damage or overheating of components, while using old solder materials may introduce impurities. Rushing through the soldering process typically results in poor technique and hasty work that can further degrade the quality of the solder joint. Therefore, prioritizing cleanliness and the prevention of cross-contamination is crucial for successful soldering outcomes.