What is a common result of solder joint fatigue failure?

A common result of solder joint fatigue failure is intermittent connections or complete failure. This occurs due to repeated mechanical stress or thermal cycling that leads to the gradual degradation of the solder joint. As these joints are subjected to constant flexing or temperature variations, the solder can crack or weaken over time, which diminishes its mechanical integrity.

This type of failure can be particularly problematic in applications where reliability is crucial, such as in electronics. The intermittent connections can cause erratic behavior in circuits, leading to malfunctioning devices, while complete failure can render the entire assembly inoperable. Understanding solder joint fatigue is essential for ensuring the longevity and reliability of soldered connections, making appropriate design considerations and material choices critical in preventing such failures.